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Professional Land Surveyor Weekly Roundup December 4, 2011
Professional Land Surveyor Weekly Roundup:
- The U.S. Geological Survey (USGS) Releases New Heights of Accuracy for World Topography
- Autodesk Introduces Cloud-based Product Lifecycle Management
- RIEGL LiDAR 2012 Registration Is Open
- Autodesk Takes BIM to the Cloud at Autodesk University
- Autodesk Previews Upcoming 3D, GPS and Plot to Print Capabilities for AutoCAD WS
- Maptek New Mid-range I-Site 8400 Laser Scanner Released
- Optech Announces Rapid Mobilization Platform for Lynx Mobile Mapper
- 5 Easy Website Improvements To Build Your Professional Land Surveying Business
- Professional Land Surveyor Now Also On Google Plus